The immersion deposition of silver onto copper and brass from deep eutectic solvents (DES) is a novel method for protecting the surface of printed circuit boards. Background mechanistic studies indicate a rapid nucleation of Ag, followed by slow bulk growth that is likely to be limited by mass transport through pores and channels in the silver deposit that are filled with the DES solution. This study aims to clarify some important points in the galvanic deposition of silver on copper. Studies show this process is sustained until complete replacement of the Cu layer is achieved. Understanding the method by which ions ingress/egress from the film and the kinetics of Ag+ ion penetration to the Cu layer, through the silver, is of key importance. The movement of solvent within the coating will aid the understanding of the mass transport process.